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Study of swelling behavior in ArF resist during development by the QCM method (3): Observations of swelling layer elastic modulus

机译:用QCM方法研究ArF抗蚀剂在显影过程中的溶胀行为(3):溶胀层弹性模量的观察

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摘要

The QCM method allows measurements of impedance, an index of swelling layer viscosity in a photoresist during development. While impedance is sometimes used as a qualitative index of change in the viscosity of the swelling layer, it has to date not been used quantitatively, for data analysis. We explored a method for converting impedance values to elastic modulus (Pa), a coefficient expressing viscosity. Applying this method, we compared changes in the viscosity of the swelling layer in an ArF resist generated during development in a TMAH developing solution and in a TBAH developing solution. This paper reports the results of this comparative study.
机译:QCM方法可以测量阻抗,即显影过程中光刻胶中溶胀层粘度的指标。尽管有时将阻抗用作溶胀层粘度变化的定性指标,但迄今为止,尚未将其定量地用于数据分析。我们探索了一种将阻抗值转换为弹性模量(Pa)(一种表示粘度的系数)的方法。应用此方法,我们比较了在TMAH显影液和TBAH显影液显影过程中产生的ArF抗蚀剂中溶胀层粘度的变化。本文报告了这项比较研究的结果。

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