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The Deformation Mechanism at Pop-in: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter

机译:弹出处的变形机理:纳米压痕下使用Berkovich压头的单晶硅

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This paper investigates the "pop-in" behavior of monocrystalline silicon under nanoindentation with a Berkovich indenter. The indentation tests were carried out under ultra-low loads, i.e. 100 μN and 300 μN, with different loading/unloading rates. It was found that with the experimentally determined area function of the indenter tip, the mechanical properties of silicon can be accurately calculated from the load-displacement data, that a pop-in event represents the onset of phase transition, and that a lower loading rate favours a sudden volume change but a rapid loading process tends to generate a gradual slope change of the load-displacement curve.
机译:本文研究了使用Berkovich压头在纳米压痕下单晶硅的“弹入”行为。压痕测试是在超低负载(即100μN和300μN)下以不同的加载/卸载速率进行的。已经发现,通过实验确定的压头尖端的面积函数,可以从负载位移数据中准确计算出硅的机械性能,弹出事件表示相变的开始,并且负载率较低有利于突然的体积变化,但是快速的加载过程往往会导致载荷-位移曲线的斜率逐渐变化。

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