Thermal Investigations on High Power LED's

摘要

The present and near future lighting solutions will include surely power light-emitting diodes (LEDs). With increasingly power offered by the modern structures, thermal management issues can arise. In this paper we present thermal investigations on three type of power LED, of 1W, 3W and a 10W module. The investigations are oriented in direction of offering trusty suggestions and solutions regarding the thermal regime of discrete LED used as stand-alone or in assembly modules. The temperature will be determined through thermal simulation. The simulation based on finite-element models will bring valuable results, especially for multiple LED modules for which the model with thermal resistance offer only global results, without information of PCB temperature. For the measurements preparation the LEDs are attached to printed circuit boards (PCBs): classic FR4 and metal core PCB (MCPCB). The measurements will be done by combining thermocouples data acquisition system with IR thermovision camera.