首页> 外文会议>9th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2001), Sep 30-Oct 3, 2001, S. Tecla, Italy >Characterization of Interstitial-Related Bulk Defects in p~- Silicon Substrates by Epitaxial Deposition
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Characterization of Interstitial-Related Bulk Defects in p~- Silicon Substrates by Epitaxial Deposition

机译:外延沉积表征p〜-硅衬底中与间隙相关的体缺陷

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Epitaxial deposition on a p" substrate that contains an A-swirl region results in characteristic defects, "warts". Transmission electron microscopy (TEM) shows that the warts are related to dislocation loops, i.e. to the A-swirls. From Burgers vector analysis it follows that the loops contain on the order of 10~9 silicon self-interstitials. Comparison of the area density (ⅰ) of so-called large-pits (l-pits) on the Secco etched substrate, (ⅱ) of warts after epitaxial deposition and (ⅲ) of defects after epitaxial deposition followed by Secco etching suggests that the light scattering cross section of warts is smaller, the lower the number of interstitials in the substrate defect that causes the wart. A model is proposed to explain the differences in the area density of l-pits on the Secco etched substrate and of defects after epitaxial deposition followed by Secco etching. The model allows one to roughly estimate the number of silicon self-interstitials per A-swirl defect for comparison with the TEM results. Reasonable agreement is found taking into account the large experimental error associated with of TEM observations on a relatively low number of defects.
机译:在包含A旋涡区域的ap“衬底上进行外延沉积会导致特征缺陷“疣”。透射电子显微镜(TEM)表明,疣与位错环(即A旋涡)有关。根据Burgers矢量分析,因此,这些环包含约10〜9个硅自填隙,比较Secco蚀刻衬底上所谓的大凹坑(l凹坑)的面积密度(ⅰ),外延后的疣的面积密度(ⅱ)外延沉积和Secco蚀刻后的缺陷沉积和缺陷的ⅲ分布表明,疣的光散射横截面越小,导致缺陷的基底缺陷中的间隙数量越少,提出了一个模型来解释该模型可以使Secco蚀刻后的衬底上的L坑的面积密度以及在外延沉积后再进行Secco蚀刻后的缺陷的面积密度,该模型可以大致估算出每个A旋流缺陷的硅自填隙数量,以便进行比较TEM结果。考虑到与TEM观察有关的相对较少缺陷数量的较大实验误差,发现了合理的一致性。

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