首页> 外文会议>9th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2001), Sep 30-Oct 3, 2001, S. Tecla, Italy >Precipitation Kinetics and Recombination Activity of Cu in Si in the Presence of Internal Gettering Sites
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Precipitation Kinetics and Recombination Activity of Cu in Si in the Presence of Internal Gettering Sites

机译:内部吸气部位存在下Si中Cu的沉淀动力学和复合活性

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The recombination activity of Cu in Si and its precipitation kinetics in the presence of internal gettering sites has been investigated. It is suggested that copper precipitates are a major recombination center in p-type silicon. Their formation is retarded in p-type silicon due to large lattice strains and electrostatic effects. The electrostatic barrier for copper precipitation disappears when the Fermi level position, determined by the concentration of shallow acceptors (boron) and shallow donors (interstitial copper) reaches the electro-neutrality level of the precipitates. Comparison of the impact of Cu on minority carrier diffusion length obtained on p-Si samples with different resistivity yielded a proof of this electrostatic model. Studies of internal gettering of copper in samples with different density of oxide precipitates indicated that oxide precipitates are relatively inefficient as sinks for copper. This might be due to the compressive lattice strain generated by both oxide precipitates and copper precipitates. Our findings indicate that the morphology of oxide precipitates may have a strong impact on their gettering efficiency.
机译:研究了内部吸杂位的存在下Cu在Si中的重组活性及其沉淀动力学。建议铜沉淀是p型硅的主要复合中心。由于大的晶格应变和静电效应,它们在p型硅中的形成受到阻碍。当费米能级位置(由浅受体(硼)和浅施主(间隙铜)的浓度决定)达到沉淀物的电中性水平时,用于铜沉淀的静电屏障消失。比较Cu对在不同电阻率的p-Si样品上获得的少数载流子扩散长度的影响,可以证明该静电模型。对具有不同氧化物沉淀物密度的样品中的铜内部吸杂的研究表明,氧化物沉淀物作为铜的下沉相对效率较低。这可能是由于氧化物沉淀物和铜沉淀物产生的压缩晶格应变所致。我们的发现表明,氧化物沉淀物的形态可能对其吸杂效率有很大影响。

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