首页> 外文会议>9th biennial conference on engineering systems design and analysis 2008 >FREEDOM OF MICRO MANUFACTURING TOOL-FREE SERIES PRODUCTION IN INDUSTRIAL APPLICATIONS OF MICRO-AND NANOTECHNOLOGY
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FREEDOM OF MICRO MANUFACTURING TOOL-FREE SERIES PRODUCTION IN INDUSTRIAL APPLICATIONS OF MICRO-AND NANOTECHNOLOGY

机译:微制造和无纳米技术在工业应用中无工具系列化生产的自由

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RMPD~®, which stands for Rapid Micro Product Development, is a family of technologies designed to generate with a parallel batch process, microstructures, microsystems and/or MEMS or MOEMS in a parallel batch process. Photo polymerized monomer, oligomere and hybrismaterial (sol-gel) polymerized with uv-light and generate the system. The technology's 3D-CSP (tree dimensional chip sice packaging), RMPD~®-multimat (volume specific material propertys), RMPD~®-stick2 (mechanical parts directly to a foil, wafer and so on) and RMPD~®-nanoface (surface roughness in sub-nm range) have since 1996 been key elements in this worldwide-patented family of technologies, which has allowed System in Packing SiP to develop into a virtually tool-free production process. Additive and parallel processes give these technologies a cost-efficient and customer oriented strategic direction.
机译:RMPD〜®代表快速微产品开发,是一系列技术,旨在通过并行批处理,并行处理,微结构,微系统和/或MEMS或MOEMS生成。光聚合的单体,低聚物和杂化材料(溶胶-凝胶)与uv光聚合并生成系统。该技术的3D-CSP(树状芯片切片包装),RMPD〜®-multimat(特定于体积的材料属性),RMPD〜®-stick2(机械零件直接贴在箔,晶片等上)和RMPD〜®-nanoface(自1996年以来,亚纳米级的表面粗糙度)一直是这一享誉全球的技术家族的关键要素,这使得System in Packing SiP可以发展为几乎无需工具的生产过程。加性和并行过程使这些技术成为具有成本效益和面向客户的战略方向。

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