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Polymer-on-Silicon Microphotonic Bench

机译:硅上聚合物微光子实验台

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摘要

We report on a polymer-on-silicon optical bench platform that enables the hybrid integration of elemental passive and active optical functions. Planar polymer circuits are produced photolithographically on silicon wafers, and a variety of inorganic materials are integrated in them by chip-to-chip attach, insertion in slots, or flip-chip mounting. The polymer waveguides represent the state of the art in polymer photonics, and include properties such as ultra-low loss (0.1 dB/cm), large refractive index contrast (up to 30%), and large thermo-optic coefficient (-3 to -4x10~(-4)/℃). The organic circuits include interconnects, static routing elements such as couplers, splitters/combiners, and power taps, as well as thermo-optically dynamic elements such as tunable couplers, spatial switches, variable optical attenuators, and tunable notch filters, with the silicon acting as the heat sink. Arrayed waveguide gratings formed in silica and silicon oxynitride are used for multi/demultiplexing. Crystal-ion-sliced thin films of lithium niobate are inserted in the polymer circuit for polarization control or for electro-optic modulation. Films of yttrium iron garnet and neodymium iron boron magnets are inserted in order to magneto-optically achieve non-reciprocal operation for isolation and circulation. Ⅲ-Ⅴ semiconductor chips based on indium phosphide and gallium arsenide are integrated in order to achieve active functions including light generation, amplification, and detection, as well as wavelength conversion. The functions enabled by this multi-material platform span the range of the building blocks needed in optical circuits, while using the highest-performance material system for each function. We present photonic subsystems-on-a-chip based on this technology, including an intelligent optical crossconnect (iOXC), a fully reconfigurable optical add/drop multiplexer (R-OADM), and a tunable optical transmitter.
机译:我们报告了一个硅基聚合物光具平台,该平台可实现元素无源和有源光学功能的混合集成。平面聚合物电路是通过光刻技术在硅片上生产的,并且通过芯片到芯片的连接,插入插槽或倒装芯片安装,将各种无机材料集成到其中。聚合物波导代表了聚合物光子学的最新技术,并具有诸如超低损耗(0.1 dB / cm),大的折射率对比度(高达30%)和大的热光系数(-3至-4x10〜(-4)/℃)。有机电路包括互连,硅的静态布线元件(例如耦合器,分离器/组合器和功率抽头)以及热光动态元件(例如可调耦合器,空间开关,可变光衰减器和可调陷波滤波器)。作为散热器。由二氧化硅和氮氧化硅形成的阵列波导光栅用于多路/多路分离。将铌酸锂的晶体离子切片薄膜插入到聚合物电路中,以进行偏振控制或电光调制。插入钇铁石榴石和钕铁硼磁铁薄膜,以磁光方式实现隔离和循环的不可逆操作。集成了基于磷化铟和砷化镓的Ⅲ-Ⅴ半导体芯片,以实现包括光产生,放大和检测以及波长转换在内的有源功能。该多材料平台支持的功能涵盖了光路所需的各种构造块,同时每种功能均使用性能最高的材料系统。我们介绍基于此技术的片上光子子系统,包括智能光交叉连接(iOXC),完全可重新配置的光分插复用器(R-OADM)和可调光发射器。

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