首页> 外文会议>5th International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS), 5th, Sep 18-20, 2000, Ostend, Belgium >A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings
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A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings

机译:控制性沉积有机污染物并用臭氧基清洁剂去除

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摘要

The efficiency of ozone based cleaning processes for the removal of typical organic contamination such as phthalates, fatty acids, siloxanes and surfactants, originating from clean room air, wafer boxes and wafer handling, is evaluated. Different cleans are effective in removing monolayers of typical clean room contaminants on silicon wafers. Prerequisite for measuring the removal efficiency of ozonated cleans for sub-monolayer organic contamination has been the development of a controlled, reproducible and quantitative deposition method for those species. It is found that deposition (contamination) of rather volatile compounds via a sealed gas phase ambient (e.g. wafer box) is less likely and thus less effective for a controlled contamination. However, via wet chemical exposure, organic compounds could be deposited onto silicon wafers in a reproducible and quantitative way.
机译:评估了臭氧清洁工艺的效率,该清洁工艺用于去除源自洁净室空气,晶圆盒和晶圆处理的典型有机污染物(例如邻苯二甲酸盐,脂肪酸,硅氧烷和表面活性剂)的效率。不同的清洗方法可有效去除硅晶圆上典型的​​洁净室污染物的单层。测量用于亚单层有机污染物的臭氧化清洁剂去除效率的前提条件是,开发出针对这些物种的可控,可重现和定量沉积方法。已经发现,经由密封的气相环境(例如晶片盒)沉积(污染)相当易挥发的化合物的可能性较小,因此对于受控的污染不太有效。然而,通过湿化学暴露,有机化合物可以以可再现和定量的方式沉积在硅片上。

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