Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
Department of Electronics, Information, and Bioengineering, Politecnico di Milano, Milan, Italy;
School of Electronic, Electrical and Systems Engineering, University of Birmingham, United Kingdom;
Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy;
real-time temperature estimation; Dynamic Compact Thermal Modeling (DCTM); power module; power converter failures;
机译:使用IGBT模拟器估计IGBT模块的功率损耗,温度和功率周期寿命
机译:功率循环倒装芯片LED模块的热瞬态测量和建模
机译:用于IGBT模块瞬态热阻抗测量和功率循环的热特性系统
机译:具有电力线路测量和紧凑型热建模的LGBT电源模块的实时温度循环估计
机译:道路嵌入式无线电力传输模块的热建模与分析
机译:SiC微型加热器芯片系统和Ag烧结连接法测量各种陶瓷DBC基板上功率模块的散热和热稳定性
机译:基于芯片温度模型的IGBT电源模块功率循环寿命估算