首页> 外文会议>55th International Astronautical Congress 2004 vol.11 >CRYOGENIC FRACTURE BEHAVIOR OF STRUCTURAL ADHESIVE FILM WITHIN CFRP-ALUMINUM BOND JOINTS
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CRYOGENIC FRACTURE BEHAVIOR OF STRUCTURAL ADHESIVE FILM WITHIN CFRP-ALUMINUM BOND JOINTS

机译:CFRP-铝键合结构胶粘剂的低温断裂行为

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摘要

The cryogenic fracture performance of structures adhesively bonded between an aluminum metal liner (Al) and CFRP laminate using structural adhesive film AF163-2K is examined in this study. The tensile Mode-I and shear Mode-II fracture strengths of CFRP-AF163-2K bond joints and AI-AF163-2K bond joints are separately evaluated at room temperature (RT) and cryogenic temperature (-163℃) using various standard testing methods for different adherend materials. The experimental results indicate that both cryogenic Mode-I and Mode-II fracture strengths of CFRP-AF163-2K bond joints dropped much more than AI-AF163-2K bond joints. The mismatch of thermal expansion ratios between CFRP laminate and AF163-2K adhesive film, which exceeds that between aluminum and AF163-2K, is considered to be the primary reason for the different cryogenic fracture behavior of the two bond structures.
机译:在这项研究中,研究了使用结构粘合膜AF163-2K粘合在铝金属衬里(Al)和CFRP层压板之间的结构的低温断裂性能。使用各种标准测试方法分别评估了室温(RT)和低温(-163℃)下CFRP-AF163-2K和AI-AF163-2K接头的I型和II型剪切断裂强度。适用于不同的被粘物材料。实验结果表明,CFRP-AF163-2K粘结接头的低温模式I和模式II断裂强度比AI-AF163-2K粘结接头的下降幅度更大。 CFRP层压板与AF163-2K粘合膜之间的热膨胀率不匹配(超过铝与AF163-2K之间的不匹配)被认为是两个键结构低温断裂行为不同的主要原因。

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