Finte Element Analysis of PMMA Microfluidic Chip Based on Hot Embossing Technique

摘要

Using creep experiment to characterize the mechanical property of PMMA has been studied in this paper. Polynomial and first order exponential decay function have been used to fit the data to get creep curve of PMMA. With the finite element analysis method and based on the creep and viscoelastic material models, simulation of the hot embossing process is carried out. Time influence on hot embossing has been emphasized. The simulation result is proved by experiments. It is shown that simulation based on viscoelastic model represents more compliance with experiments, and can describe the process of polymer deformation during hot embossing.