THE EADS MICROPACK PROJECTA HIGHLY INTEGRATED MICROSYSTEM FOR FUTURE SMALL SPACERAFT

摘要

The global Micro-electromechanical (MEMS) orMicrosystems Technology (MST) market is forecast tokeep growing at a phenomenal rate. EADS recognisesthe potential for MEMS to revolutionise the spaceindustry, where it can dramatically reduce mass, sizeand power requirements and therefore mission cost. Asa result, for several years now, EADS has beeninvestigating the issues of packaging MEMS devicesinto larger systems (e.g. packaging and electronics)rather than just issues with individual MEMS devicesthemselves. This has seen a progression in thedevelopment of packaged Microsystems for spaceapplications (called 'micropacks') becomingincreasingly condensed. Indeed this has culminated inthe completion of a micropack prototype using a novelmodular approach to packaging.