Monte Carlo Simulation of Void Concentrations in Surface Mounted Solder Joints

摘要

At certain concentrations, voids inside soldering joints can decrease the reliability and the life of thernjoint. This study employed Monte Carlo simulation to study the distribution of void concentrations inrncritical areas of passive chip components. Results show that destructive concentrations of voids occur inrncritical areas of the joint with increasing probability, as the process produces voids in excess of 10%.