Results from an Evaluation of Different SBU Technologies

摘要

The number of commercially available sequential build-up substrate technologies (SBU), also called build-up multilayer (BUM), is constantly increasing. At this point in time, there are at least 16 different technologies used in various products. The advantages of the SBU technologies compared to FR-4 printed wiring boards (PWBs) are numerous. Some of the most obvious are the possibility of reducing the size of the boards, the number of layers, and the improved fan-out capacity. These SBU properties are essential to the production of Chip Scale Packages and Flip Chip assemblies.