首页> 外文会议>33rd European Solid-State Device Research Conference (ESSDERC 2003); Sep 16-18, 2003; Estoril, Portugal >Self-Heating Characterization and Extraction Method for Thermal Resistance and Capacitance in High Voltage MOSFETs
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Self-Heating Characterization and Extraction Method for Thermal Resistance and Capacitance in High Voltage MOSFETs

机译:高压MOSFET热阻和电容的自加热特性和提取方法

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This work reports on the self-heating effect (SHE) characterization of HV DMOSFETs and the accurate extraction of the equivalent thermal impedance of the device (thermal resistance, R_(TH), and capacitance, CTH) needed for advanced device and IC simulation. A simple pulsed-gate experiment is proposed and the influence of its parameters (pulse duration and duty factor) are analysed. It is demonstrated that in our 100V DMOSFET, SHE is cancelled by using pulses with duration less that 2μs and duty factor lower that 1:100. The new extraction method of device thermal resistance and capacitance exploits analytical modelling and dedicated extraction plots using the measurements of output characteristics at various applied pulses and the gradual reduction of SHE with pulse duration and duty factor. Both R_(TH) and C_(TH) are assumed and extracted in saturation region as quasi-independent functions of the device bias (injected power) at a given external temperature. We originally report on the temperature dependence of the HV device thermal resistance that is shown to be a linear function of external temperature (in our device, R_(TH) could increase by almost 100% over 100℃). SPICE simulations with the extracted thermal R_(TH)-C_(TH) circuit are finally used to fully validate the proposed method.
机译:这项工作报告了HV DMOSFET的自热效应(SHE)特性,并精确提取了高级器件和IC仿真所需的器件等效热阻(热阻R_(TH)和电容CTH)。提出了一个简单的脉冲门实验,并分析了其参数(脉冲持续时间和占空比)的影响。事实证明,在我们的100V DMOSFET中,通过使用持续时间小于2μs且占空比小于1:100的脉冲可以消除SHE。器件热阻和电容的新提取方法利用分析模型和专用提取图,利用各种施加脉冲下的输出特性测量结果以及随着脉冲持续时间和占空比逐渐降低SHE的情况。在给定的外部温度下,R_(TH)和C_(TH)均被假定并提取到饱和区域中,作为器件偏置(注入功率)的准独立函数。我们最初报道了高压设备热阻的温度依赖性,该温度依赖性是外部温度的线性函数(在我们的设备中,R_(TH)在100℃时可能会增加近100%)。最后,利用提取的热R_(TH)-C_(TH)电路进行SPICE仿真,以完全验证所提出的方法。

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