Automatic Generation of In-Circuit Tests for Board Assembly Defects

摘要

The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies" stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.