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A lightweight X-masking scheme for IoT designs

机译:物联网设计的轻量级X屏蔽方案

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The emerging Internet-of-Things (IoT) paradigm creates a new market for very small and cost-sensitive chips. Design costs must be as low as possible in order to be competitive. In this context, the 1-pin test has proven to be a beneficial way to significantly reduce test costs. However, the incorporated signature generation requires an X-free design, which is not always possible (e.g. due to timing exceptions in transition tests). Available X-masking approaches target large circuits and are therefore not suitable due to their large area overhead or because they require additional pins. In this paper, we present a solution to this business case problem. A new X-masking scheme with very small area overhead and the ability for usage during 1-pin test is proposed. We present experimental results on industrial designs. Those experiments show for the first time that transition tests with X-values in their response can be applied during 1-pin test. The method has been successfully verified on silicon and is already being applied during productive test application.
机译:新兴的物联网(IoT)范例为非常小且成本敏感的芯片创造了新的市场。设计成本必须尽可能低,以便具有竞争力。在这种情况下,已证明1针测试是一种显着降低测试成本的有益方法。但是,合并的签名生成需要无X设计,这并非总是可能的(例如,由于过渡测试中的时序异常)。可用的X掩膜方法以大型电路为目标,因此由于其大面积开销或需要额外的引脚而不合适。在本文中,我们提出了针对该业务案例问题的解决方案。提出了一种新的X-masking方案,该方案具有非常小的面积开销和在1-pin测试期间的使用能力。我们介绍工业设计的实验结果。这些实验首次表明,可以在1针测试期间应用响应中带有X值的过渡测试。该方法已经在硅上成功验证,并且已经在生产测试应用中应用。

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