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Comparative analysis of 2T, 3T and 4T DRAM CMOS cells

机译:2T,3T和4T DRAM CMOS单元的比较分析

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In this paper various popular topologies of DRAM cells are designed and analyzed on deep submicron technology. Now a days in all digital data processors and controllers memory blocks have become decisive part for overall performance of system. Selecting a DRAM cell topology from all available types significantly increases design time and efforts. Some popular DRAM topologies are 2T, 3T and 4T cells. In above context, performance analysis and comparison of 2T, 3T and 4T DRAM cells have been carried out in this work. Concerned cells are compared on the basis of their read access time, write access time, retention time and power dissipation. All design and simulation work has been performed on Tanner EDA tool.
机译:在本文中,基于深亚微米技术设计并分析了DRAM单元的各种流行拓扑。现在,所有数字数据处理器和控制器中的存储块已经成为系统整体性能的决定性部分。从所有可用类型中选择DRAM单元拓扑会显着增加设计时间和工作量。一些流行的DRAM拓扑是2T,3T和4T单元。在上述背景下,这项工作已经进行了2T,3T和4T DRAM单元的性能分析和比较。根据相关单元的读取访问时间,写入访问时间,保留时间和功耗进行比较。所有设计和仿真工作均已在Tanner EDA工具上执行。

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