Toward building energy management: Electric analog modeling for thermal behavior simulation

摘要

The most energy in buildings is used for space cooling and heating. Thus, the thermal analysis is necessary to reach thermal comfort and energy efficiency in buildings. In this paper, we present a thermal envelope modeling based on thermal-electrical analogy for thermal behavior simulation. The research object is a real platform inside our laboratory building in France. To illustrate this study, two thermal zone model represent two room of this platform, and they are surrounded by another thermal zones of laboratory building. Their parameters have been identified from envelope properties. Then, these models are implemented in a simple equivalent electric circuit, simulated and validated with measurement data.