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Structure and ferroelectric properties of high TcBi(Me)O3-PbTiO3 single crystal thin films

机译:高T c Bi(Me)O 3 -PbTiO 3 单晶薄膜的结构和铁电性能

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Pb(Zr,Ti)O (PZT) piezoelectric ceramics with higher Curie temperature T are necessary for a fabrication of better micro actuators, sensors, memories and/or piezoelectric micro electromechanical systems(MEMS). New piezoelectric materials with higher Tbeyond PZT are extensively studied. Among the new piezoelectric materials, Bi(Me)O-xPbTiO ceramics(Me: Yb, In, Sc) are fascinated for the higher T materials. In this paper thin films of single crystal (1-x)BiScO-xPbTiO (BS-xPT) were deposited by an rf-magnetron sputtering for a better understanding of ferroelectric performance of the BS-xPT. We have made a laminated composite structure comprising relaxed hetero-epitaxial single crystal thin films of high TBS-xPT (0.5≤x≤0.8) and SrRuO(SRO)/Pt/MgO hetero-structural substrates. It was confirmed their ferroelectric performances of the BS-xPT thin films were comparable to the PZT based thin films: a thin film transverse piezoelectricity e was -6.7C/m at x=0.8 with 2P=~60μC/cm, 2E=~250 kV/cm, and ε/ε=~150. The BS-0.8PT thin films exhibit extraordinary high T with T=750°C. The enhanced T is caused by the presence of the high temperature stable interface in the laminated composite structure. The present BS-xPT thin films have a high potential for a fabrication of high temperature stable piezoelectric MEMS beyond PZT.
机译:具有较高居里温度T的Pb(Zr,Ti)O(PZT)压电陶瓷是制造更好的微致动器,传感器,存储器和/或压电微机电系统(MEMS)所必需的。具有更高的超越PZT的新型压电材料得到了广泛的研究。在新型压电材料中,Bi(Me)O-xPbTiO陶瓷(Me:Yb,In,Sc)着迷于高T材料。在本文中,通过射频磁控溅射沉积单晶(1-x)BiScO-xPbTiO(BS-xPT)薄膜,以更好地了解BS-xPT的铁电性能。我们已经制成了包含高TBS-xPT(0.5≤x≤0.8)的弛豫异质外延单晶薄膜和SrRuO(SRO)/ Pt / MgO异质结构衬底的叠层复合结构。证实了其BS-xPT薄膜的铁电性能可与PZT基薄膜相媲美:薄膜横向压电e在x = 0.8时为-6.7C / m,2P =〜60μC/ cm,2E =〜250 kV / cm,ε/ε=〜150。 BS-0.8PT薄膜在T = 750°C时表现出非常高的T. T的提高是由于层压复合结构中存在高温稳定界面而引起的。本发明的BS-xPT薄膜具有制造超出PZT的高温稳定压电MEMS的高潜力。

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