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A Polystrata® 820 mW G-Band Solid State Power Amplifier

机译:Polystrata®820 mW G波段固态功率放大器

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Using the PolyStrata® 3D additive fabrication process, a novel 16-Way solid state power amplifier at Gband frequency range is demonstrated. InP DHBT PA MMICs, with an excess of 80 mW output power and >15 dB small signal gain, are used in this SSPA. To connect the MMICs to the 16-way splitter-combiner network, a micromachined WR4 E-probe to CPW transition was developed. These transitions use micro-length-wire-bonds exhibiting capability at sub-mmw frequencies. The broadband transitions showcase <;0.5 dB insertion loss and exhibit tight tolerances due to the batch additive manufacturing process. The SSPA was assembled using 16 mounted MMICs with transitions and demonstrated >11 dB small signal gain from 200-230 GHz. Large signal characterization showcased high saturated output power of 580 mW at 200 GHz, 820 mW at 216 GHz, 680 mW at 225 GHz and 380 mW at 230 GHz in an ultra-compact volume of 45 cm3 demonstrating a functional power density of >18 mW/cm3. Nuvotronics measured 823 mW at 216 GHz representing a 15.9% increase to the state of the art for a power module above 210 GHz, while reducing by half the number of MMICs required as compared to other approaches.
机译:使用PolyStrata®3D增材制造工艺,展示了一种在Gband频率范围内的新型16路固态功率放大器。该SSPA使用的InP DHBT PA MMIC具有超过80 mW的输出功率和大于15 dB的小信号增益。为了将MMIC连接到16路分离器-组合器网络,开发了微加工WR4 E探针到CPW的过渡。这些过渡使用的微长度引线键合在亚毫米波频率下具有显示能力。宽带过渡显示出<; 0.5 dB的插入损耗,并且由于批量增材制造工艺而表现出严格的公差。 SSPA使用16个安装的带过渡的MMIC组装而成,在200-230 GHz的频率下显示出> 11 dB的小信号增益。大信号表征显示了在45 cm3的超紧凑体积中200 GHz时580 mW,216 GHz时820 mW,225 GHz时680 mW和230 GHz时380 mW的高饱和输出功率,表明功能功率密度> 18 mW / cm3。 Nuvotronics在216 GHz下测得的823 mW功率是210 GHz以上功率模块的最新水平的15.9%,与其他方法相比,所需的MMIC数量减少了一半。

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