A LTCC-BGA multi-chip packaging technology for MMICs up to Ku-band

摘要

In this paper a highly integrated MCP concept apply to MMICs from DC up to Ku-band is presented. This type of package of low-temperature co-fired ceramic system-in-package (LTCC-SIP) with ball grid array (BGA) structures hereby can realize miniaturization, low-weight and multifunction. More than one of the multi-function MMICs are wire-bonding or flip-chip mount on the top of multilayer LTCC substrate which was integrated all kinds of passive functions such as filter, resistance, capacitance, and the SIP can be surface mount on a PCB serving as motherboard through the via and BGA on the bottom side. The simulation and measurement for this package of the return loss return loss were −12dB at 18GHz that can meet the need of most of RF performance. And the size of the final package of the single channel RF LTCC-SIP we processed is 55mm × 20mm × 4.5mm, which is 1.4% of traditional RF module, and the package is 10g in weight, which is also 1.4% of the tradition RF module.