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Development of fast neutral etching for integrated circuits and nanotechnologies fast neutrals in gas

机译:开发用于集成电路和纳米技术的快速中性蚀刻,用于气体中的快速中性

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In this paper we attempt to correlate the recently developed procedure to use fast neutrals as a replacement to fast positive ions in charging free plasma etching with the development in gas discharge, atomic and molecular collision and swarm physics. It is shown how ideas in the gas discharges progressed and how, when it became well known that charging is one of the primary problems in integrated circuit manufacture, it became possible to transfer the ides directly to the processing technology. Our ability to describe sources of fast neutrals as well as possible future developments and applications are also discussed.
机译:在本文中,我们尝试将最近开发的程序与使用快速中性离子取代无电荷等离子体蚀刻中的快速正离子与气体放电,原子和分子碰撞以及群物理学的发展联系起来。示出了气体放电中的思想如何发展,以及当众所周知电荷是集成电路制造中的主要问题之一时,如何将其直接转移到加工技术上成为可能。还讨论了我们描述快速中立源的能力以及未来可能的发展和应用。

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