首页> 外文会议>2013 IEEE International Conference on Solid Dielectrics >Effect of interface polarization on dielectric properties in nanocomposite compounded with epoxy and montmorillonite
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Effect of interface polarization on dielectric properties in nanocomposite compounded with epoxy and montmorillonite

机译:界面极化对环氧树脂与蒙脱土复合纳米复合材料介电性能的影响

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Epoxy/organic-montmorillonite nanocomposites were prepared with different organic-montmorillonite and content of montmorillonite by diglycidyl ether of bisphenol A. Chemical composition of different organic-montmorillonite was analyzed by Fourier Transition Infrared(FTIR). The temperature properties of resistivity of composites were measured by Megger. The temperature dependence of composites dielectric spectrum was verified by using a Schering bridge. The results show that whether octadecyl ammonium chloride or the coupling agent KH550, they can interact with the montmorillonite both. The test results of the composite indicated that, inclusion of K-MMT and O-MMT into epoxy matrix can reduce permittivity and dissipation factor. The permittivity and dissipation factor of K-MMT/EP composites respectively reduced 5% and 35%, and those of O-MMT/EP composites respectively reduced 16% and 41%, when testing temperature is 160°C. It can be confirmed that epoxy improved by organic-montmorillonite is provided with better heat resistance property than those of pure epoxy. As for O-MMT/EP composites, the permittivity and dissipation factor of composites that contains 5wt% O-MMT is lowest. For instance, the permittivity reduced 18% and the dissipation factor reduced 42% than pure epoxy, when it is room temperature and power frequency.
机译:用双酚A的二缩水甘油醚制备了具有不同有机蒙脱土和含量的蒙脱土的环氧/有机蒙脱土纳米复合材料。采用傅里叶变换红外光谱(FTIR)分析了不同有机蒙脱土的化学组成。复合物的电阻率的温度特性通过Megger测量。复合材料的介电谱对温度的依赖性通过Schering电桥进行了验证。结果表明,无论是十八烷基氯化铵还是偶联剂KH550,它们都可以与蒙脱石相互作用。复合材料的测试结果表明,在环氧树脂基体中加入K-MMT和O-MMT可以降低介电常数和损耗因子。当测试温度为160°C时,K-MMT / EP复合材料的介电常数和耗散系数分别降低5%和35%,O-MMT / EP复合材料的介电常数和耗散系数分别降低16%和41%。可以确认,有机蒙脱石改良的环氧树脂具有比纯环氧树脂更好的耐热性。对于O-MMT / EP复合材料,O-MMT含量为5wt%的复合材料的介电常数和耗散系数最低。例如,在室温和工频下,介电常数比纯环氧树脂降低18%,耗散因数降低42%。

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