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Worst-Case Critical-Path Delay Analysis Considering Power-Supply Noise

机译:考虑电源噪声的最坏情况临界路径延迟分析

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As technology further scales, inaccurate prediction of IR-drop effect during scan testing could cause significant under estimation of the critical path delay, and further leads to serious issues such as insufficient guard band application, test escape, chip mis-binning and more. In this paper, a novel layout-aware path delay test generation method is proposed to maximize the effect of power-supply noise on target paths during delay test. It is able to estimate supply noise fast by calculating transition propagation probability and running fault simulation. Based on such estimation, the correlation between path-delay fault (PDF) and transition-delay fault (TDF) patterns is calculated to find the best sequence to merge patterns. The final generated path-delay test is able to simultaneously increase the local and global power-supply noise, thus furthur capture the worst-case timing scenarios of the target path. Experimental results show that the final PDF pattern can increase the path delay significantly comparing with the nominal PDF pattern and the best randomly-filled PDF pattern.
机译:随着技术的进一步扩展,在扫描测试期间对IR下降效应的不正确预测可能会导致严重估计的关键路径延迟不足,并进一步导致严重问题,例如保护带应用不足,测试逃逸,芯片误合并等。在本文中,提出了一种新颖的布局感知路径延迟测试生成方法,以最大化延迟测试期间电源噪声对目标路径的影响。它可以通过计算过渡传播概率和运行故障仿真来快速估计电源噪声。基于这种估计,计算路径延迟故障(PDF)模式和过渡延迟故障(TDF)模式之间的相关性,以找到合并模式的最佳顺序。最终生成的路径延迟测试能够同时增加本地和全局电源噪声,从而进一步捕获目标路径的最坏情况时序情况。实验结果表明,与标称PDF模式和最佳随机填充PDF模式相比,最终PDF模式可以显着增加路径延迟。

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