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Analysis of emission from a printed circuit board with a microstrip line and a slot

机译:分析带有微带线和缝隙的印刷电路板的发射

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By advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we analyze the coupling between a microstrip line and a slot in a ground on a PCB using the MTL method to examine an effect of the signal integrity for the slot in the ground. And also we analyze emission from a PCB with slot using coupling slot voltages which is calculated by the MTL method. To calculate by using the MTL method, per-unit-length parameters, such as the self or mutual capacitances and inductances, of a microstrip line and a slot are calculated using the FDTD method. Finally, we show the validity of the method in this paper, comparing results using the MTL method with numerical results using the FDTD method. It is shown that the proposed method is validated by comparing results by the MTL method with results by the FDTD.
机译:随着电子设备的小型化的发展,印刷电路板的接地趋向于小而复杂,并且该接地可能具有一些缺陷,例如连接器或通孔的通孔。在本文中,我们使用MTL方法分析了PCB上微带线和接地槽之间的耦合,以检查接地槽信号完整性的影响。并且我们还使用通过MTL方法计算出的耦合槽电压来分析带槽PCB的发射。为了使用MTL方法进行计算,使用FDTD方法计算微带线和缝隙的单位长度参数,例如自电容或互电容和电感。最后,通过将使用MTL方法的结果与使用FDTD方法的数值结果进行比较,我们证明了该方法的有效性。结果表明,通过比较MTL方法的结果和FDTD的结果,可以验证该方法的有效性。

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