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Deeply-Scaled E/D-Mode GaN-HEMTs for Sub-mm-Wave Amplifiers and Mixed-Signal Applications

机译:适用于亚毫米波放大器和混合信号应用的深尺度E / D模式GaN-HEMT

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In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.
机译:在本文中,我们报告了通过创新的器件缩放技术(例如垂直缩放的AlN / GaN / AlGaN双异质结(DH)HEMT外延结构,低密度的外延结构)实现的,基于GaN的HEMT的最新高频性能。 MBE会重新生长电阻n + -GaN欧姆接触,以及可制造的20 nm自对准侧壁栅极工艺。工程学的顶级阻挡层结构使增强模式和耗尽模式(E / D)器件能够以创纪录的截止频率运行,同时保持Johnson Johnson品质因数(JFoM)的击穿性能。此外,E / D模式器件使用完整的外延再生技术进行单片集成,并成功展示了DCFL环形振荡器电路。具有前所未有的高频和高击穿特性的深度扩展E / D模式GaN-HEMT在电路应用中具有实际优势,例如亚毫米波功率放大器,超线性混频器以及数字输出功率的增加-模拟转换器。

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