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Recent progress in silicon-based millimeter-wave power amplifier

机译:硅基毫米波功率放大器的最新进展

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This paper reports the recent research advancements in silicon-based millimeter-wave solid-state power amplifier (PA). It provides an in-depth overview that facilitates PA designers to select a suitable silicon-based topology based on the vital aspects of process and design technique. The crucial active devices used for fabrication including standard CMOS, CMOS SOI, SiGe BiCMOS and GaN on SiC are introduced. The state-of-the-art architectures for power combining are compared in terms of power delivered, power added efficiency (PAE), bandwidth and reflection coefficient. A major emphasis is placed on the 60 GHz solid-state PAs, as it is the driving force in silicon-based RFIC development.
机译:本文报道了基于硅的毫米波固态功率放大器(PA)的最新研究进展。它提供了深入的概述,可帮助PA设计人员根据工艺和设计技术的重要方面选择合适的基于硅的拓扑。介绍了用于制造的关键有源器件,包括标准CMOS,CMOS SOI,SiGe BiCMOS和SiC上的GaN。在功率输出,功率附加效率(PAE),带宽和反射系数方面对用于功率组合的最新架构进行了比较。 60 GHz固态PA是主要重点,因为它是基于硅的RFIC开发的推动力。

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