Out-of-plane connection in an orthogonal assembly

摘要

In this work, an out-of-plane connection in an orthogonal assembly is demonstrated. The proposed method for the orthogonal connection will help to overcome critical issues faced in this type of connection, such as lead transfer and bonding plane mismatch. It proposed to utilize the laser assisted soldering technique to achieve the lead transfer in the connection. Being a highly flexible probe array, it is more conformal to the tissue, minimizing tissue damage after implantation. Compared to previous works, the proposed flexible probe array has excellent flexibility and can easily conform to the shape of tissue, preventing the micromotion of probe after implantation. The measured impedance at the typical frequency of action potential (1 kHz) is about 12.8 kΩ.