首页> 外文会议>IEEE International Conference on Solid-State and Integrated Circuit Technology;ICSICT-2012 >Repack: A packing algorithm to enhance timing and routability of a circuit
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Repack: A packing algorithm to enhance timing and routability of a circuit

机译:重新打包:一种打包算法,可增强电路的时序和可布线性

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With the advent of the great challenge brought by increasing complexity of modern large circuit, a pressing and necessary problem, that is, improving the routability and timing performance, is proposed in front of us. A novel packing algorithm called repack based on enhanced packing attraction function is presented while at the same time an iterative CAD flow tool could provide decreased interconnection resources requirement by applying CLB depopulation at given routing channel width limitation and local congested situations. Experimental results show that, for non-iterative flow, compared to the T-VPack and iRAC, repack can achieve 6.4% and 8.1% improvement respectively in timing performance. However, for iterative flow, when compared to T-VPack, repack has 12.6% and 37.6% improvement in area and routing path width respectively. When compared to iRAC, repack has a 0.9% decrease in area, but it has an improvement of 16.2% in routing path width instead.
机译:随着现代大型电路日益复杂化带来的巨大挑战的到来,摆在我们面前的是一个紧迫而必要的问题,即提高布线能力和定时性能。提出了一种基于增强的包装吸引函数的称为重新包装的新颖包装算法,同时,迭代的CAD流程工具可以通过在给定的路由通道宽度限制和局部拥塞情况下应用CLB人口减少对互连资源的需求。实验结果表明,对于非迭代流,与T-VPack和iRAC相比,重新打包可在计时性能上分别提高6.4%和8.1%。但是,对于迭代流,与T-VPack相比,重新打包的面积和路由路径宽度分别提高了12.6%和37.6%。与iRAC相比,重新打包的面积减少了0.9%,但路由路径宽度却提高了16.2%。

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