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Analysis of crosstalk between micorstrip lines located along a ground slot on a printed circuit board

机译:分析沿着印刷电路板上接地槽的微带线之间的串扰

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By advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we analyze the crosstalk between microstrip lines on a PCB with a ground slot along lines using the MTL method to examine an effect of the crosstalk for the slot in the ground. To calculate by using the MTL method, per-unit-length parameters, such as the mutual capacitance and inductance, of a microstrip line and a slot are calculated using the FDTD method. Finally, we show the validity of the method comparing numerical results using the MTL method with numerical results using the FDTD method.
机译:随着电子设备的小型化的发展,印刷电路板的接地趋向于小而复杂,并且该接地可能具有一些缺陷,例如连接器或通孔的通孔。在本文中,我们使用MTL方法分析了具有接地槽沿PCB的PCB上微带线之间的串扰,以研究接地槽对串扰的影响。为了使用MTL方法进行计算,使用FDTD方法计算微带线和缝隙的每单位长度参数,例如互电容和电感。最后,我们证明了将MTL方法的数值结果与FDTD方法的数值结果进行比较的方法的有效性。

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