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Epitaxial-side-down-mounted interband cascade lasers

机译:外延面朝下安装的带间级联激光器

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A rapid series of recent performance advances have established the interband cascade laser (ICL) as a practical midwave infrared (mid-IR) diode source that may be expected to find broad use in a variety of applications ranging from infrared countermeasures to chemical spectroscopy. The ICL is effectively a hybrid of the conventional diode laser, in that injected electrons and holes recombine to create photons, and the quantum cascade laser (QCL), in that a multi-stage staircase of active quantum wells is connected in series. The ICL also differs from both, however, in that most of the electrons and holes needed for lasing are created internally at semimetallic interfaces separating the stages rather than being injected from the contacts. The ICL performance recently improved dramatically when “carrier rebalancing”, via heavy n-type doping of the electron injector regions, was introduced to equalize the electron and hole populations in the active quantum wells [1]. Recent publications have reported cw operation up to 109 °C, cw output power up to 158 mW at room temperature (RT, taken here to be 25 °C), RT cw wallplug efficiency up to 13.5%, RT cw drive power as low as 29 mW (more than 20 times lower than the best QCLs results reported to date), and RT cw operation to wavelengths as long as 5.7 μm [1,2]. Here we discuss further improvements of the lasing characteristics that occur when the ICLs are mounted epitaxial-side-down (epi-down), using a proprietary NRL procedure that combines high performance with high processing yield.
机译:最近的一系列快速性能改进已将带间级联激光器(ICL)确立为实用的中波红外(mid-IR)二极管光源,有望在红外对策到化学光谱学等各种应用中找到广泛的用途。 ICL实际上是传统二极管激光器(其中注入的电子和空穴复合以产生光子)和量子级联激光器(QCL)(其中有源量子阱的多级阶梯串联连接)的混合体。但是,ICL也不同于两者,因为激射所需的大多数电子和空穴是在分隔各级的半金属界面内部产生的,而不是从触点注入的。最近,通过引入电子注入区的n型重掺杂来实现“载流子再平衡”,以均衡有源量子阱中的电子和空穴,ICL性能得到了显着改善[1]。最近的出版物报道,连续波工作温度高达109°C,在室温下连续波输出功率高达158 mW(RT,此处为25°C),RT连续墙插头的效率高达13.5%,RT连续波驱动功率低至29 mW(比迄今报道的最佳QCL结果低20倍以上),RT cw的工作波长长达5.7μm[1,2]。在这里,我们讨论了使用专有的NRL程序(将高性能与高处理良率相结合)将ICL外延面朝下安装(epi-down)时产生的激光特性的进一步改进。

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