Single hole at constrained location for stress analysis in PCB plate bending

摘要

In this paper, simulation on the bending process of PCB during depaneling was done. The stress response during the bending process was evaluated using a computational program Ansys version 11. Two PCB plate model were developed: one of the model with single hole and other model without hole. The stress responce of the two models were then compared. From the simulation, it has been observed that the value of stress response of the PCB increases with increasing displacement height. The PCB model with single hole exhibited higher stress compared to the PCB model without hole. Highest stress response was obtained at the displacement height of 5cm for both models.