The theoretical investigation of the effect of adhesive layers used in microassembly on the dynamic response of a microaccelerometer

摘要

The effect of using adhesive in microassembly on the dynamical behavior of a one-directional microaccelerometer is investigated. The adhesives exhibit Viscoelastic properties and their behavior obeys the Kelvin-Voigt model. The equivalent stiffness and damping coefficient of an adhesive layer are determined according to its Young's modulus, viscosity coefficient, adhesion area and thickness. There are three adhesive layers used to attach different parts in the studied package. As a consequence, the full dynamical model which takes into account the effect of three adhesive layers is a four-degree-of-freedom system. The equation of motion of microaccelerometer by considering the adhesive layers are derived and simulated in MATLAB Simulink. In the result section, the effect of different adhesive properties like Young's modulus and viscosity coefficient as well as geometric features such as adhesion area and thickness of adhesive layers on the displacement of proof mass is presented.