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Understanding CMUTs with substrate-embedded springs

机译:了解带有基板嵌入式弹簧的CMUT

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A capacitive micromachined ultrasonic transducer (CMUT) with substrate-embedded springs, as named post-CMUT or PCMUT, provides many benefits over a conventional CMUT having flexural plate movement. Since the PCMUT structure resembles an ideal piston transducer, the improvements in performance mainly stem from the higher average displacement of the top plate for a given gap height. In this work, comprehensive 3-D finite element analysis (FEA) models are developed to further our understanding of the PCMUT structure. The 3-D FEA models include 3 analysis types, i.e. static, modal, and harmonic analyses, to fully understand the static and dynamic behavior of the PCMUT structure. To reduce the long simulation runtime, simplified 3-D FEA models with quarter symmetry and ideal springs are used instead of full transducer element models. We show that modal analysis results of the 3-D FEA models are in good agreement with the experimental results obtained from the first-generation fabricated PCMUT devices. Two top plate types are considered for the PCMUT structure and hence included in our model: a uniform plate (type 1) and a non-uniform plate (type 2) having a thinner edge portion than its center. Based on the 3-D FEA models, comprehensive parametric simulations were performed for both plate types to understand the effect of each parameter on the static and dynamic behavior. The plate type 2 provided better overall performance than the plate type 1. For the simulated designs the average DC displacement achieved using the plate type 2 was over 50% larger than that for the plate type 1. The FEA simulations also revealed that careful attention must be paid to the engineering of the top plate to assure that unwanted higher plate modes do not interfere with the normal operation of the device within the desired frequency band.
机译:与称为挠性板移动的传统CMUT相比,带有后置式弹簧的电容性微机械超声换能器(CMUT)(称为CMUT或PCMUT)具有许多优势。由于PCMUT结构类似于理想的活塞换能器,因此性能的提高主要源于在给定间隙高度下顶板的平均位移更高。在这项工作中,我们开发了全面的3D有限元分析(FEA)模型,以进一步了解PCMUT结构。 3-D FEA模型包括3种分析类型,即静态,模态和谐波分析,以充分了解PCMUT结构的静态和动态行为。为了减少长时间的仿真运行时间,使用具有四分之一对称性和理想弹簧的简化3-D FEA模型代替完整的传感器元件模型。我们表明,3-D FEA模型的模态分析结果与从第一代制造的PCMUT器件获得的实验结果非常吻合。 PCMUT结构考虑了两种顶板类型,因此包括在我们的模型中:均匀板(类型1)和边缘部比中心薄的非均匀板(类型2)。基于3-D FEA模型,对两种板类型进行了全面的参数仿真,以了解每个参数对静态和动态行为的影响。 2型板比1型板具有更好的整体性能。对于模拟设计,使用2型板所获得的平均DC位移要比1型板大50%以上。FEA仿真还表明,必须格外注意必须注意顶板的工程设计,以确保不需要的较高板模式不会干扰所需频段内设备的正常运行。

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