首页> 外文会议>2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertanties due to 3D heat losses
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Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertanties due to 3D heat losses

机译:开发用于高导电性CVD金刚石的测量技术,并分析3D热损失引起的不确定性

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Thermal spreaders have been of interest over the last few decades. Heat pipes, Thermal Pyrolytic Graphite (TPG), and other graphite-based materials have been commonly used for enhancing the thermal performance. This study will start for a discussion of Chemical Vapor Deposition (CVD) of diamond manufacturing to enable high conductivity plates for heat spreading. Later attention will be turned to absolute thermal conductivity measurements. A measurement technique for the thermal conductivity of a thin diamond plate was proposed. Baseline measurements have been established via a similar copper plate with a thermal conductivity of 400 W/m-K. IR thermal images were collected. Heat losses are calculated via analytical and numerical models. We found that one type of thermal management CVD diamond has a thermal conductivity of approximately 820 W/m-K accounting both diamond film and thin Silicon substrate.
机译:在过去的几十年中,散热器一直很受关注。热管,热解石墨(TPG)和其他基于石墨的材料已普遍用于增强热性能。这项研究将开始讨论金刚石制造中的化学气相沉积(CVD),以使高导热率的板能够散布热量。稍后将注意力转向绝对热导率测量。提出了一种测量金刚石薄板导热系数的技术。已通过类似的铜板以400 W / m-K的导热系数建立了基线测量值。收集红外热图像。通过分析和数值模型计算热损失。我们发现一种类型的热管理CVD金刚石具有约820 W / m-K的导热率,这可以解释金刚石膜和薄硅基板。

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