REVIEW OF REFRIGERATION TECHNOLOGIES FOR HIGH HEAT DISSIPATION ELECTRONICS COOLING

摘要

It is envisioned that conventional air cooling techniques using heat sinks are not able to sufficiently cool future generations of high heat dissipation semiconductor processors. Thus, alternative cooling approaches are being extensively studied as substitutes. This paper presents a literature review of the available refrigeration systems and system simulation models for electronics cooling. The results of this review are used to facilitate an ongoing effort by the authors to develop and design a Miniature-Scale Refrigeration System (MSRS) for high heat dissipation electronics cooling as well as the development of an MSRS simulation model.