Simulation and Analysis of Via Effects on High Speed Signal Transmission on PCB

摘要

Via effects on signal transmission and reflection are presented in this paper. The via interconnects a transmission line on a high-speed multi-layered Printed Circuit Board. By modeling the via's equivalent circuit, calculating its reactance values, and analyzing the effects of its capacitance and inductance on signal transmission, a conclusion is drawn that the higher the operation frequency is, the more attention should be paid to the via. A simulation of a microstrip with or without a via on a 4-layered Printed Circuit Board is performed to obtain the S-parameters under different frequencies. The results also testify the conclusion above.