Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

摘要

A technology platform demonstrating wafer-level high density multifunctional integration (HDMI) based upon three-dimensional (3D) technology is described, which offers the potential for future low-cost integration of information processing and sensor/actuator technologies. This HDMI scheme alleviates processing and material constraints associated with system-on-a-chip (SoC) electronic integration, while providing the capability of extension to opto-electronic, bio-molecular and other microano heterogeneous system applications. Process development results obtained to date are discussed, and approaches to heterogeneous integration using this novel technology platform are outlined.