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DIRECT METAL LASER SINTERING IN 20 μm LAYER THICKNESS

机译:以20μm的层厚直接进行金属激光烧结

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摘要

The latest developments in Direct Metal Laser Sintering (DMLS) materials and equipment have brought the minimum layer thickness of the DMLS process from 50 μm (0.0020 in.) to 20 μm (0.0008 in.). The utilization of thinner layers has enabled laser sintering of very fine details with improved surface quality and accuracy. Although using thinner layers increases building time the advantage is gained in drastically reduced finishing times. Moreover, the improved mechanical properties of both steel and bronze based materials have enabled rapid manufacturing of functional components for demanding prototype and small series production applications, e.g. metal components for prototype gearboxes, engines and electric devices. The presentation will demonstrate the current status of the DMLS process and the properties of commercially available steel and bronze materials for 20 μm layer thickness. Some commercial prototype component and rapid tooling cases will also be presented.
机译:直接金属激光烧结(DMLS)材料和设备的最新发展已使DMLS工艺的最小层厚度从50μm(0.0020英寸)增加到20μm(0.0008英寸)。较薄层的利用使得能够对非常精细的零件进行激光烧结,从而提高了表面质量和精度。尽管使用较薄的层会增加制造时间,但在大幅减少精加工时间方面却具有优势。而且,钢和青铜基材料的改善的机械性能使得能够快速制造功能部件,以用于要求苛刻的原型和小批量生产应用,例如。变速箱,发动机和电气设备原型的金属部件。该演讲将展示DMLS工艺的当前状态以及20μm层厚度的市售钢和青铜材料的性能。还将介绍一些商业原型组件和快速工具箱。

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