COMPUTATIONAL AND EXPERIMENTAL STUDY OF THERMO-MECHANICS IN A NEW DESIGN OF A TRANSCEIVER FOR HIGH-SPEED TELECOMMUNICATIONS

摘要

High-speed telecommunications require ever increasing data rates, pushing the limits of existing hardware and driving the development of new data handling hardware. This paper addresses thermo-mechanical issues in a new Input/Output (I/O) device for highspeed telecommunications. This device is a surface mount-compatible fiber optic transceiver developed as the Small Form-Factor Pluggable (SFP) System. The development of the SFP System is supported by virtually every leading fiber optic transceiver manufacturer in the industry in accordance with the Multi Source Agreement (MSA). We describe the new MSA-compliant SFP System, develop a FEM model to simulate its thermal behavior under a variety of operating conditions, and present results of the simulation which are validated by selected experimental measurements.