Fatigue Life Analysis by Finite Element Method for CSP Mounting on Build-up Board

摘要

CSP (Chip Scale Package) and/or BGA (Ball Grid Array) are becoming the important new high-density packaging technology for the consumer electric products. In addition, the use of build-up boards for mounting the CSP packages has been tried. However, the reliability of the solder connection depends on the structure of the package, the motherboard, and the material properties. In this paper, the solder connection reliability for CSP packages, mounted on the build-up board, is assessed. The results based on optimizing each of the parameters are reported. The most reliable packaging design and a compact FEM (Finite Element Method) model for the reliability assessment are suggested. For introduction to the reliability assessment of the FCA attachment, ceramic and silicon are compared as the inter-poser with the parameter of the solder height. The verification of the numerical analysis results using tests on the actual hardware is also shown.