Goremate~(TM) Novel High Density Contactor

摘要

Test and burn-in of integrated circuits are crucial steps in assuring die reliability prior to assembly. Historically, this has been done by probing wafers with expensive and relatively slow wafer probers. Recently, W. L. Gore & Associates has developed a contact technology to be used in conjunction with a high density test board for wafer level burn-in and test (WLBT). Goremate~(TM) wafer contactors are a matrix of ePTFE metallized in specific patterns to provide excellent z-axis conductivity while providing a compliant member able to take up non-planarity between the test board and wafer under test. Performance data including resistance, compression, and compliance are presented. Alternative metal finishes and feature sizes for high density interconnection are discussed as well as several potential new applications for Goremate~(TM) contactor technology.