首页> 外文会议>1st International EUSPEN Conference Vol.1, May 31st-Jun 4th, 1999, Bremen, Germany >Effect of Workpiece Material Properties on Micro-cutting Process
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Effect of Workpiece Material Properties on Micro-cutting Process

机译:工件材料特性对微切削加工的影响

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摘要

In the machining of mirror-like surfaces, a typical cutting depth of a few micrometers is common. With such a small depth of cut, the chip formation takes place inside individual grains of a polycrystalline materials. In this paper, an orthogonal cutting of a copper single crystal was performed in order to investigate the dependency of the cutting deformation and the machined surface quality on crystallographic orientations of the substrate materials. The experimental results show that the crystallographic orientations of the workpiece material exert a great influence on the shear angle and the surface quality. The measured values of the machined surface roughness correspond well with the experimental data of the shear angle.
机译:在加工镜面表面时,通常的切削深度为几微米。在如此小的切削深度下,切屑的形成发生在多晶材料的单个晶粒内。在本文中,进行了铜单晶的正交切割,以研究切割变形和机加工表面质量对基底材料晶体学取向的依赖性。实验结果表明,工件材料的晶体学取向对剪切角和表面质量影响很大。机加工表面粗糙度的测量值与剪切角的实验数据非常吻合。

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