THERMAL AND MECHANICAL PERFORMANCE OF TAB INTERCONNECTS AT CRYOGENIC TEMPERATURES

摘要

A tab interconnection process has been developed which allows the thermal isolation for a hybrid assembly operating in a cryogenic environment. The relative success of the process indicates there are no fundamental barriers limiting the use of the TAB structure in a low temperature environment. Further, the results imply that slight material process deviations may be implemented into the standard TAB process cycle. The effort utilized FEA methods for optimization and environmental test for performance and verification.rnOne additional result of this effort was the fact that if certain minimum standards are met in the design process, the abnormally high start-up costs for TAB interconnects may be avoided. In this project proper device metallization and passivation design guides were met, JEDEC standards for the tape were met, lead forming was avoided, and excise tooling was avoided. Based on this, a very modest cost wasrnincurred for the prototype run. Further efforts with regard to this development activity will include ILB pull test equipment, acquisition of additional thermal conductivity data on manganin, and process development into alternative surface treatments.