ACTIVE PACKAGING FOR LOW-COST MIXED-SIGNAL MCMS

摘要

We will describe a silicon-on-silicon technology that incorporates both active and passive components in the MCM substrate. Previous generations of this technology took advantage of silicon IC technology to fabricate large numbers of passive electronic components in the MCM substrate. We have now extended this approach to include active bipolar devices. We discuss some of the system requirements that led to the development of this technology for a telephone application. We will present some of the active device characteristics and limitations, and discuss their use in general applications.