EFFECT OF Cu ON THE ELECTROCHEMICAL CORROSIONBEHAVIOR OF Sn-9Zn SOLDER IN 3.5 NaCl SOLUTION

摘要

The corrosion behavior of Sn-9Zn-Xcu(X＝0, 2, 4, 6% wt) solders had been investigated withrnpotentiodynamic polarization in 3.5% NaCl solution. The results showed that the addition of Cu improvedrnthe corrosion potential of Sn-9Zn solder. The more Cu is added, the higher the corrosion potential ofrnSn-9Zn solder is. In addition, the addition of Cu induced corrosion form of solders to change tornuniformity corrosion from partial corrosion and formed relative protective scale on the surface ofrnSn-9Zn-Xcu solder.