Application of Computational Mechanics to Reliability Studies of Electronic Packaging

摘要

Computational mechanics approaches, especially computational fracture mechanics, have been utilized as a powerful tool for reliability studies of large-sized structures such as air crafts, pressure vessels, piping and so on. Electronic packages are considered as small-sized structures to protect electrical integrity of electronic devices. So the computational mechanics can be successfully applied to the reliability studies of electronic packaging. In the electronic packages, there exist a lot of interfaces between different materials, so that the interface fracture mechanics is very useful for such studies. In the first part of the present paper, we summarize the interface fracture mechanics, and then we provide two examples of the application of computational mechanics to the reliability studies of electronic packaging. One example is the strength evaluation of a plastic package during solder reflow process, and another is the delamination evaluation of anisotropic conductive adhesive films under moisture/reflow sensitivity tests.