Making high-performance organic IC substrates necessitate more consideration than making PCB's, even though the manufacturing processes share great similarities. Besides narrow line width/space and smaller via si2e, high-performance IC substrates often require specialty materials and circuit designs to achieve low impedance power distribution and low loss/high speed signal propagation. Manufacturing processes also need to be carefully selected or fine-tuned so as to produce the PCB like panels at reasonable yields. Upon completion of the board manufacturing and subsequent substrate singulation, IC substrates must be qualified for various assembly processes and must pass a series of stringent environmental tests. Therefore, the substrates are also required to exhibit robust thermal mechanical behavior and to perform well in harsh environments.
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