The present invention relates to a rework system performing a de-soldering or a soldering work for repairing or recovering a chip installed on a printed circuit board by heating a ball grid array (BGA), which is a kind of a surface installation package used in an integrated circuit and, more specifically, to a BGA rework system necessarily required for a residue removal device for automatically removing the residue (remaining solder) remaining on a necessarily picked-up semiconductor chip from the PCB to perform the automated BGA rework. According to the present invention, the BGA rework system for removing a solder residue after a semiconductor chip is removed from the PCB to be repaired comprises: an absorbing body which has the size corresponding to the size of the position where the semiconductor chip of the PCB is removed; and a heating member for melting the residue remaining on the PCB.
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